職務說明：

1.Participate in the development of memory IC packaging (DRAM and Flash memory).

2.Verify and integrate memory ICs, ensuring performance across various platforms in module form.

3.Coordinate necessary engineering communication with memory IC suppliers.

4.Assist in production line yield issue analysis and troubleshooting to improve process efficiency.

5.Collaborate on major customer complaint investigations and analysis.

6.Handle other tasks assigned by supervisors. 

1.參與記憶體IC(DRAM、Flash memory)封裝開發。

2.記憶體IC驗證與導入，以模組的形式，確認在不同平台上的表現。

3.與記憶體IC的供應商進行必要的工程聯繫。

4.協助產線分析並排除良率問題，提升流程效率。

5.共同參與重大客訴問題分析。

6.其他主管交辦任務。 

專業能力：

1.Familiarity with DRAM and Flash memory characteristics (electrical, material, and process properties) is preferred.

2.Experience in DRAM and Flash memory product engineering is a plus.

3.Hands-on experience in DRAM and Flash memory test development is a plus.

4.Experience in IC packaging design and process development is a plus.

5.Intermediate English proficiency (TOEIC 500+).

1.熟悉DRAM、Flash memory元件特性(電氣特性、材料特性、製程特性、…)尤佳。

2.具DRAM、Flash memory產品工程經驗尤佳。

3.具DRAM、Flash memory 測試開發經驗尤佳。

4.具IC封裝設計與製程開發相關經驗尤佳。

5.英文中等以上(多益500+)。

職能特質：

 Strong communication and coordination skills. 

良好溝通協調能力。