職務說明：

The IC Subcon Assembly Engineer is responsible for overseeing the outsourced assembly and packaging operations through subcontractors (OSATs). This role serves as a bridge between internal design/manufacturing teams and external assembly partners, ensuring streamlined workflow, high-quality output, and cost-effective production throughout the assembly and packaging process.

Essential Functions:
NPI & Project Management
* Lead packaging development from prototype stage to high-volume production ramp-up.
* Collaborate with cross-functional teams to ensure successful new product introduction (NPI) at OSATs.

Technical Support & Problem Solving
* Provide technical support for assembly-related issues (e.g., wafer preparation, wire bonding, molding, flip chip...)
* Work with OSAT and internal teams to resolve reliability, yield, and test-related issue.
* Drive continuous process improvements and cost optimization initiatives.

Assembly Process and Quality Control
* Support assembly material selection and ensure alignment with package design requirements.
* Analyze yield and defect data, perform root cause analysis, and drive corrective actions.

Cross-Functional Communication
* Act as a communication bridge between OSATs engineering teams and internal engineering teams
* Support annual audit and customer audit activity 

專業能力：

Required:
* 3+ years of experience in IC packaging, assembly engineering, or subcontractor management.
* Strong communication and cross-functional collaboration skills in both English and Chinese.

Preferred:
* Experience in working with OSATs in Asia (e.g., Taiwan, China)
* Knowledge of package reliability testing and qualification.