Job Description

1.Participate in the development of memory IC packaging (DRAM and Flash memory).

2.Verify and integrate memory ICs, ensuring performance across various platforms in module form.

3.Coordinate necessary engineering communication with memory IC suppliers.

4.Assist in production line yield issue analysis and troubleshooting to improve process efficiency.

5.Collaborate on major customer complaint investigations and analysis.

6.Handle other tasks assigned by supervisors. 

Professional Competencies

1.Familiarity with DRAM and Flash memory characteristics (electrical, material, and process properties) is preferred.

2.Experience in DRAM and Flash memory product engineering is a plus.

3.Hands-on experience in DRAM and Flash memory test development is a plus.

4.Experience in IC packaging design and process development is a plus.

5.Intermediate English proficiency (TOEIC 500+).

Core Competencies and Traits

Please provide a bulleted list of behavioral traits or soft skills related to teamwork, communication, and adaptability in a dynamic work environment.